Inficon SQC-310 Thin Film Deposition Controller Manuel d'utilisateur

SQC-300 SeriesThin Film Deposition ControllersUser’s GuideVersion 4.10© Copyright Sigma Instruments, Inc. 2002 - 2007Sigmainstruments

Chapter 1 Quick Start1-41.3 System ConnectionsSensorFeedthroughIn-VacCable6" BNC CableOscillatorSourceShutterGround W ireEvaporation SupplyOutput

Chapter 1 Quick Start1-51.4 InstallationWARNING: Care should be exercised to route SQC-300 cables as far as practical fromother cables that carry high

Chapter 1 Quick Start1-61.5 MenusAt power up the SQC-300 briefly displays initialization and version information, then theMain screen.Note: If you are

Chapter 1 Quick Start1-7The six SoftKey legends along the left side of the screen will change, depending on thestatus of the process and the functions

Chapter 1 Quick Start1-81.6 Thin Film Deposition OverviewThe SQC-300 stores the recipes, and provides the operating functions, required tocontrol thin

Chapter 1 Quick Start1-91.7 Building a ProcessThis section presents a brief guide to building and running a simple one layer process.Chapter 2 covers

Chapter 1 Quick Start1-10SelectProcessPress the Process Menu SoftKey to view a list of processes.Turn the setting knob to scroll to an entry in the li

Chapter 1 Quick Start1-11EditLayerWith Layer 1 selected, press Edit to display the Layer Editmenu for Layer 1.F n l T h kT h ic k n e s s L im itS ta

Chapter 1 Quick Start1-121.8 Depositing a FilmNote: You can simulate the steps below, without actually depositing a film, by going tothe System Params

Chapter 1 Quick Start1-13

Safety InformationRead this manual before installing, operating, or servicing equipment. Do not installsubstitute parts, or perform any unauthorized m

Chapter 2 Operation2-1Chapter 2 - Operation2.0 IntroductionThis chapter describes common tasks associated with operating the SQC-300. Itassumes that y

Chapter 2 Operation2-22.2 Defining a FilmA film is a material to be deposited, plus all of its associated setup parameters. Keep inmind that a film ca

Chapter 2 Operation2-3With Material highlighted, press Edit to scroll through the list of available materials.Select the desired material and press En

Chapter 2 Operation2-4Now press Deposit Controls. The Deposit Controls menu contains parameters thatmodify operation during the deposition phase.Captu

Chapter 2 Operation2-52.3 Defining a ProcessTo define a process, press Next Menu until the Process Menu SoftKey is shown. PressProcess Menu. A list of

Chapter 2 Operation2-6To delete a layer, highlight it in the Layer Select menu and press Cut/Paste.On the Cut/Paste menu, press Cut to remove the laye

Chapter 2 Operation2-72.4 Defining a LayerTo edit a Process Layer, press Process Menu. Select the desired process, then pressEdit. Finally, select the

Chapter 2 Operation2-82.5 Sensor SetupSensor setup involves selecting the sensor(s) to be used, setting the Min/Max crystalfrequencies, and adjusting

Chapter 2 Operation2-9determined by some other means, such as a stylus profilometer). Then the tooling forthis sensor would be:(1.100 / 1.000) x 100 =

Chapter 2 Operation2-102.6 Source SetupThe SQC-300 controls deposition rate by varying the control voltage to an externalevaporation (source) supply.T

Warranty InformationThis Sigma Instruments product is warranted against defects in material andworkmanship for a period of 2 years from the date of sh

Chapter 2 Operation2-112.7 Running a ProcessOnce a Process is defined with the desired Layers, and the sensors and source supplyare properly connected

Chapter 2 Operation2-12M a in S c re e nZ e roN e x tL a y e rN e x tM e n uQ u ic kE d itA u to /M a n u a lP ro c e s s 1 : L a y e r 1 o f 1 R u n

Chapter 2 Operation2-13Press Stop to halt the current layer. You can restart the current layer pressing Start.Press Next Layer, then Start, to start a

Chapter 2 Operation2-14While the process is running, a Stop Layer SoftKey is shown. Pressing Stop Layertemporarily halts the current Layer.L a y e r S

Chapter 2 Operation2-152.8 Loop TuningThis section will help you adjust your control loop PID parameters to achieve a stabledeposition process. Keep i

Chapter 2 Operation2-16increase the P Term. A lower I Term will increase response time, a higher value willeliminate ringing and setpoint deviations.

Chapter 2 Operation2-172.9 TroubleshootingMost SQC-300 problems are caused by defective crystals or improper film setup,particularly incorrect PID set

Chapter 2 Operation2-18When the frequency reading is stable, reconnect the source supply. Start thedeposition process in Manual mode with 0% power. Th

Chapter 2 Operation2-19

Chapter 3 Menus3-1Chapter 3 - Menus3.0 IntroductionThree menus on the Main Screen control SQC-300 operation. The SoftKeys associatedwith each of these

Table of ContentsChapter 1 - Quick Start...1-11.0 Introd

Chapter 3 Menus3-23.1 Main Screen, Menu 1The table below describes the function of each SoftKey on Main Screen, Menu 1.NextMenuSequences through each

Chapter 3 Menus3-33.2 Main Screen, Menu 2The table below describes the function of each SoftKey on Main Screen, Menu 2.NextMenuSequences through each

Chapter 3 Menus3-43.3 Main Screen, Menu 3Menu 3 can be accessed only while the process is stopped. This menu gives access toprocess, film, and system

Chapter 3 Menus3-53.4 Quick Setup MenuThe Quick Setup Menu provides access to the most commonly adjusted parameters forthe current process and layer.F

Chapter 3 Menus3-6potentially unstable) loops. Try a value of 50, then gradually increase/decrease thevalue to respond to step changes in rate setpoin

Chapter 3 Menus3-73.5 Process MenusThere are several tiers of Process Menus. The first menu (shown below) selects thecurrent process. The current proc

Chapter 3 Menus3-8Selecting Edit on the Process Select Menu shows the sequence of layers that will bedeposited in the selected process.Layer Select Me

Chapter 3 Menus3-93.6 Layer Edit MenuEach layer consists of a film (i.e. a material), plus the deposition rate and thickness thatare desired for the l

Chapter 3 Menus3-10Thickness Limit: Sets an arbitrary thickness when the thickness limit relay is activated.Start Mode: Determines whether a layer beg

Chapter 3 Menus3-11Ramp 1: During the deposition of a layer, it may be desirable to change the depositionrate. For example, you may want to deposit sl

Chapter 5 - Communications...5-15.0 Introduction...

Chapter 3 Menus3-123.7 Cut/Copy and Insert MenusCut/Copy and Insert menus are used to build and edit a sequence of process layers.The Layer Select Men

Chapter 3 Menus3-13On the Cut/Paste menu, highlight a layer and press Cut to remove the layer. The cutlayer is removed from the process and placed on

Chapter 3 Menus3-143.8 Film MenusEach film has certain characteristics that determine how it should be deposited. TheFilm Menus allow you to set param

Chapter 3 Menus3-15The parameters on the Film Edit Menu are those most commonly modified. Additionalfilm parameters are available by pressing Film Con

Chapter 3 Menus3-16The Film Conditioning Menu contains the power settings used before and afterdeposition. Definitions of each parameter appears later

Chapter 3 Menus3-17The Deposit Controls Menu contains the settings used to control shutters andinstrument response during error conditions. Definition

Chapter 3 Menus3-18A description of each film parameter follows:P Term: The proportional term sets the gain of the control loop. High gains yield more

Chapter 3 Menus3-19Xtal Fail Mode: Programs the action when the last sensor assigned to a film fails.Selecting Halt stops the process. When Timed Powe

Chapter 3 Menus3-20Rate Sampling: Rate sampling can extend the life of crystals. With rate sampling, thedeposition rate is sampled for a period of tim

Chapter 3 Menus3-213.9 System Parameters MenuThe System Parameters Menu contains settings that affect the basic operation of theSQC-300. System parame

Chapter 3 Menus3-22Descriptions of each System Parameter follows:Period: Sets the measurement period between .1 second (10 readings per second) and1 s

Chapter 3 Menus3-23Pocket Wait: This parameter has two functions, depending on the setting of the PocketReady signal in I/O setup. If no Pocket Ready

Chapter 3 Menus3-243.10 Relay and Input SetupThe Input and Relay SoftKeys of the System Parameters Menu allow you to map theeight digital inputs and t

Chapter 3 Menus3-25In the I/O Setup Menu, any number of “events” can be mapped to the physical inputsand relays. Options are set by selecting a relay

Chapter 3 Menus3-26

Chapter 4 Maintenance4-1Chapter 4 - Maintenance4.0 IntroductionThis section covers maintenance, cleaning, software upgrades, and the installation ofop

Chapter 4 Maintenance4-24.2 Software UpgradesThe SQC-300 firmware (Flash software) can be upgraded through its RS-232 port. Theupgrade program, SigmaF

Chapter 4 Maintenance4-34.3 Option Card InstallationThe option card adds two additional sensor inputs, two control outputs, and 8 digital I/Osignals t

Chapter 4 Maintenance4-44.5 Full Rack Extender InstallationThe Full Rack Extender option (PN 900-007) mounts an SQC-310 into a full width 19”rack spac

Chapter 5 Communications5-1Chapter 5 - Communications5.0 IntroductionThe SQC-300 series communicates with a host computer through three possibleprotoc

Chapter 1 Quick Start1-1Chapter 1 - Quick Start1.0 IntroductionSigma’s SQC-300 series instruments are multi-channel QCM-based depositioncontrollers. T

Chapter 5 Communications5-2 The CRC is shifted right one bit position. If a character’s least significant bit is a 0 then the CRC is exclusive OR’d

Chapter 5 Communications5-35.3 SQC-300 CommandsGet ModelCommand: @Description: Returns the model number and software version number.Parameters: NoneEx

Chapter 5 Communications5-42 Capture 6 Sample Accuracy3 Control Error (0,1,2) 7 Sample Hold4 Control Percent 8 Sample TimeExample: To Get the P I D pa

Chapter 5 Communications5-5Get/Set Process ParametersCommand: CDescription: Gets/sets the four process parameters. In the parameters list below,Number

Chapter 5 Communications5-64 Thickness Limit 16. Ramp1 Time5 Start Mode 17. Ramp2 Enable6 Output 18. Ramp2 Start7 Max. Power 19. Ramp2 Rate8 Slew rate

Chapter 5 Communications5-7Delete All LayersCommand: EDescription: Deletes all 250 layers! Most often used to clear the entire inreument inpreparation

Chapter 5 Communications5-8The return string for Start Layer and Stop Layer would be: 1,3 2,4To Set the same parameters you would send: G1 1,3 2,4Get/

Chapter 5 Communications5-9Get ReadingsCommand: KDescription: Returns the phase time and sensor or output readings for all installedchannels.Parameter

Chapter 5 Communications5-10Get Sensor ThicknessCommand: NDescription: Returns the thickness reading for the requested sensor.Parameters: Sensor Numbe

Chapter 5 Communications5-11Get Output DeviationCommand: QDescription: Returns the % deviation of the requested output.Parameters: Output NumberExampl

Chapter 1 Quick Start1-21.1 Front PanelSoftKeys Control Knob Remote JackFront Panel ControlsSoftKeys Provide access to instrument operations and setup

Chapter 5 Communications5-12Set Run StateCommand: UDescription: Sets the instruments operating state.Parameters:0 = Start Process 31 = Soak/Hold1 = St

Chapter 5 Communications5-13Get Power ResetCommand: YDescription: Gets the status of the power reset flag.Parameters: NoneExample: Y returns 0 if rese

AppendixA. Material ParametersIn the table below, an * is used to indicate that the material’s Z Factor is not known. Amethod of determining Z Factor

AppendixFormula Density Z-Ratio Material NameCa 1.550 2.620 CalciumCaF23.180 0.775 Calcium FluorideCaO 3.350 *1.000 Calcium OxideCaO-SiO22.900 *1.000

AppendixFormula Density Z-Ratio Material NameFe 7.860 0.349 IronFe2O35.240 *1.000 Iron OxideFeO 5.700 *1.000 Iron OxideFeS 4.840 *1.000 Iron SulphideG

AppendixFormula Density Z-Ratio Material NameLa 6.170 0.920 LanthanumLa2O36.510 *1.000 Lanthanum OxideLaB62.610 *1.000 Lanthanum BorideLaF35.940 *1.00

AppendixFormula Density Z-Ratio Material NameNi 8910 0.331 NickelNiCr 8.500 *1.000 NichromeNiCrFe 8.500 *10~ InconelNiFe 8.700 *1.000 PermalloyNiFeMo

AppendixFormula Density Z-Ratio Material NameSm 7.540 0.890 SamariumSm2O37.430 *1.000 Samarium OxideSn 7.300 0.724 TinSnO26.950 *1.000 Tin OxideSnS 5.

AppendixFormula Density Z-Ratio Material NameVO24.340 *1.000 Vanadium DioxideW 19.300 0.163 TungstenWB210.770 *1.000 Tungsten BorideWC 15.600 0.151 Tu

AppendixB. SpecificationsMeasurementNumber of SensorsFrequency RangeFrequency AccuracyFrequency ResolutionRate AccuracyRate Display ResolutionThicknes

Chapter 1 Quick Start1-31.2 Rear Panel100 -120/200-2 40 V ~50/60 H z25 V AS en so r 1 S en so r 2 O u tpu t 1 O u tp ut 2 I/O 1-8R S -23 2S en so r 3

AppendixDisplayGraphs Rate, Deviation, PowerReadouts Thickness, Rate, PowerProcess Parameters (a Process is a sequence of layers)# Processes 100# Film

AppendixC. I/O ConnectionsA 25 pin D-sub connector, located on the rear of the SQC-300, provides Input/Outputconnections. Refer to Section 3.6 for rel

AppendixInterfacing to a Sigma CI-100 IndexerBCD I/O (Sigma 902-025)BCD wiring between the CI-100 and SQC 300 Series controllers (refered to below asS

AppendixInterfacing to an MDC SweeperBCD I/O (Sigma 902-027)Wiring between the SQC 300 series controllers (refered to below as SQC-3XX) ) and anMDC sw

AppendixD. Handheld Remote ControllerThe Handheld Controller provides the capability of adjusting output power remotelywhen the SQC-300 is in Manual M

AppendixE. EC Declaration of ConformityManufacturer’s Name: Sigma InstrumentsManufacturer’s Address: 120 Commerce Drive, Unit 1Fort Collins, CO 80524